Intel Corporation
Semiconductor chip manufacturing process for integrating logic circuitry, embedded DRAM and embedded non-volatile ferroelectric random access memory (FERAM) on a same semiconductor die

Last updated:

Abstract:

An apparatus is described. The apparatus includes a semiconductor chip that includes logic circuitry, embedded dynamic random access memory (DRAM) cells and embedded ferroelectric random access memory (FeRAM) cells.

Status:
Grant
Type:

Utility

Filling date:

30 Sep 2016

Issue date:

17 Aug 2021