Intel Corporation
Fast memory for programmable devices

Last updated:

Abstract:

An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.

Status:
Grant
Type:

Utility

Filling date:

11 Dec 2019

Issue date:

24 Aug 2021