Intel Corporation
Fast memory for programmable devices
Last updated:
Abstract:
An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.
Status:
Grant
Type:
Utility
Filling date:
11 Dec 2019
Issue date:
24 Aug 2021