Intel Corporation
Systems and methods to reduce FinFET gate capacitance
Last updated:
Abstract:
The disclosure illustrates systems and methods for removing at least some excess gate material of a FinFET transistor. A FinFET transistor with the excess gate material removed may include a gate with a T-shaped cross-section. The narrower portion of the cross-section may be processed using backside wafer processing. The width of the narrower portion may be defined by a spacer.
Status:
Grant
Type:
Utility
Filling date:
29 Dec 2016
Issue date:
31 Aug 2021