Intel Corporation
Group III-V semiconductor fuses and their methods of fabrication

Abstract:

Group III-V semiconductor fuses and their methods of fabrication are described. In an example, a fuse includes a gallium nitride layer on a substrate. An oxide layer is disposed in a trench in the gallium nitride layer. A first contact is on the gallium nitride layer on a first side of the trench, the first contact comprising indium, gallium and nitrogen. A second contact is on the gallium nitride layer on a second side of the trench, the second side opposite the first side, the second contact comprising indium, gallium and nitrogen. A filament is over the oxide layer in the trench, the filament coupled to the first contact and to the second contact wherein the filament comprises indium, gallium and nitrogen.