Intel Corporation
CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN TO CARBON BASED FILL PARTICLE BONDS

Abstract:

Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.