Intel Corporation
DISAGGREGATED DIE WITH INPUT/OUTPUT (I/O) TILES

Abstract:

Embodiments may relate to a die with a processor. The die may include a first input/output (I/O) tile adjacent to a first side of the processor, and a second I/O tile adjacent to a second side of the processor. The first or second I/O tiles may be communicatively coupled with the processor. Other embodiments may be described or claimed.