Intel Corporation
CUSTOMIZED INTEGRATED HEAT SPREADER DESIGN WITH TARGETED DOPING FOR MULTI-CHIP PACKAGES

Abstract:

Embodiments include semiconductor packages. A semiconductor package includes a first die and a second die on a package substrate, and an integrated heat spreader (IHS) over the first die, the second die, and the package substrate, wherein the IHS has a lid and a plurality of sidewalls. The semiconductor package also includes a plurality of conductive slugs in the lid of the IHS. The lid of the IHS has a bottom surface that is coplanar to bottom surfaces of the conductive slugs. The conductive slugs are comprised of high-k thermal conductive materials, including cubic boron nitride, hexagonal boron nitride, graphite, carbon-based materials, diamonds, or diamond-based materials. The bottom surfaces of the conductive slugs are on a top surface of the first die and a top surface of the second die. The IHS is comprised of thermal conductive materials, including aluminum, copper, copper-based metals, or alloys.