Intel Corporation
COMPOSITE THERMAL MATRIX

Abstract:

Embodiments herein relate to systems, techniques, and/or processes directed to a composite thermal matrix structure to provide thermal conductivity within a package. The composite thermal matrix may include a first material that is substantially solid and a second material that is liquid and absorbed into the first material. A package may include the composite thermal matrix within an integrated heat sink coupled with a printed circuit board and encapsulating one or more die where the thermal matrix structure is in a state of compressive stress within the heat sink. The thermal matrix structure may expand and contract as the heat sink warps during thermal cycling to maintain constant thermal conductivity with low stress on the package.