Intel Corporation
HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINMENT STRUCTURES

Abstract:

An integrated circuit assembly may be formed comprising at least one integrated circuit device, a heat dissipation device having a thermal contact surface with at least one containment structure extending into or from the heat dissipation device at the thermal contact surface, and a thermal interface material between the at least one integrated circuit device and the heat dissipation device, wherein the thermal interface material contacts the at least one containment structure of the heat dissipation device.