Intel Corporation
HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL CROSS-TALK

Abstract:

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises an interposer, a first die attached to the interposer, and a second die attached to the interposer. In an embodiment, the electronic package further comprises a heatsink thermally coupled to the first die and the second die. In an embodiment, the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die. In an embodiment, the heatsink comprises a thermal break between the first die and the second die.