Intel Corporation
MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING

Abstract:

A modular technique for die-level liquid cooling is described. In an example, an integrated circuit assembly includes a first silicon die comprising a device side and a backside opposite the device side. The integrated circuit assembly also includes a second silicon die comprising a plurality of fluidly accessible channels therein. A dielectric interface directly couples the second silicon die to a backside of the first silicon die.