Intel Corporation
Methods and apparatus to implement microphones in thin form factor electronic devices

Abstract:

Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.