Intel Corporation
Printed wiring-board islands for connecting chip packages and methods of assembling same

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Abstract:

A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.

Status:
Grant
Type:

Utility

Filling date:

29 Sep 2017

Issue date:

28 Sep 2021