Intel Corporation
MICROELECTRONIC PACKAGE WITH REDUCED THROUGH-SUBSTRATE ROUTING

Abstract:

Embodiments may relate to a microelectronic package that includes an active die at a first side of the substrate and an interconnect at a second side of the substrate. A high-speed input/output (HSIO) die may also be coupled with the first side of substrate. The HSIO die may be coupled with the active die by a bridge. Other embodiments may be described or claimed.