Intel Corporation
Technologies for a metal chassis for an electronic device

Abstract:

Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.