Intel Corporation
Dynamically configurable multi-chip package

Abstract:

A semiconductor die includes one or more semiconductor devices (e.g., memory array, processors), first and second banks of I/O ports arranged along one or more sides of the die, and a multiplexing circuit. The multiplexing circuit can be changed between a first state and a second state. In the first state the first bank of I/O ports is coupled to the semiconductor device(s) and the second bank of I/O ports is not coupled to the semiconductor device(s), and in the second state the first bank of I/O ports is not coupled to the semiconductor device(s) and the second bank of I/O ports is coupled to the semiconductor device(s). The state of the multiplexing circuit can be set, for example, by an on-die fuse circuit or an externally accessible select line. The semiconductor die can be included in a chip package, which can be included on a printed circuit board.