Intel Corporation
INDUCTIVE COUPLING STRUCTURES FOR REDUCING CROSS TALK EFFECTS IN PARALLEL BUS TECHNOLOGIES
Last updated:
Abstract:
In one embodiment, an apparatus includes a circuit board having a parallel bus with a first trace and a second trace, a first inductive coil coupled to the first trace, and a second inductive coil coupled to the second trace. The first and second inductive coils are arranged to inductively couple with one another to reduce cross talk effects in the parallel bus.
Status:
Application
Type:
Utility
Filling date:
21 Jun 2021
Issue date:
7 Oct 2021