Intel Corporation
GROUND PIN FOR DEVICE-TO-DEVICE CONNECTION

Abstract:

Examples described herein relate to a pin arrangement that includes a first signal pin; a second signal pin; and multiple parallel ground pins positioned between the first and second signal pins. In some examples, the multiple parallel ground pins are coupled to a single pin connector coupled to a first device and a single pin connector coupled to a second device. In some examples, a first leg of the multiple parallel ground pins is positioned parallel to a portion of the first signal pin and wherein a second leg of the multiple parallel ground pins is positioned parallel to a portion of the second signal pin. In some examples, the multiple parallel ground pins provide a 1:N signal to ground ratio for signals transmitted through at least a portion of the first and second signal pins, where N is greater than 1.