Intel Corporation
SUB-AMBIENT COOLING SYSTEM WITH CONDENSATION CONTROL FOR USE WITH ELECTRONIC DEVICES AND RELATED METHODS

Abstract:

Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.