Intel Corporation
STORAGE SYSTEM WITH INTERCONNECTED SOLID STATE DISKS
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Abstract:
An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
Status:
Application
Type:
Utility
Filling date:
1 Apr 2021
Issue date:
21 Oct 2021