Intel Corporation
Wide bandgap group IV subfin to reduce leakage

Last updated:

Abstract:

A subfin layer is deposited on a substrate. A fin layer is deposited on the subfin layer. The subfin layer has a conduction band energy offset relative to the fin layer to prevent a leakage in the subfin layer. In one embodiment, the subfin layer comprises a group IV semiconductor material layer that has a bandgap greater than a bandgap of the fin layer.

Status:
Grant
Type:

Utility

Filling date:

29 Jun 2016

Issue date:

19 Oct 2021