Intel Corporation
Wide bandgap group IV subfin to reduce leakage
Last updated:
Abstract:
A subfin layer is deposited on a substrate. A fin layer is deposited on the subfin layer. The subfin layer has a conduction band energy offset relative to the fin layer to prevent a leakage in the subfin layer. In one embodiment, the subfin layer comprises a group IV semiconductor material layer that has a bandgap greater than a bandgap of the fin layer.
Status:
Grant
Type:
Utility
Filling date:
29 Jun 2016
Issue date:
19 Oct 2021