Intel Corporation
Flexible shield for semiconductor devices
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Abstract:
An electronic device and associated methods are disclosed. In one example, the electronic device includes a first device and a second device coupled to a surface of a substrate, and a continuous flexible shield woven over the first device and under the second device to separate the first device from the second device. In selected examples, the continuous flexible shield may be formed from a laminate and one or more of the devices may be coupled through an opening or via in the continuous flexible shield.
Status:
Grant
Type:
Utility
Filling date:
24 Jun 2019
Issue date:
16 Nov 2021