Intel Corporation
INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS
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Abstract:
An example relates to an integrated circuit including a semiconductor substrate, and a wiring layer stack located on the semiconductor substrate. The integrated circuit further includes a transistor embedded in the wiring layer stack. The transistor includes an embedded layer. The embedded layer has a thickness of less than 10 nm. The embedded layer includes at least one two-dimensional crystalline layer including more than 10% metal atoms. Further examples relate to methods for forming integrated circuits.
Status:
Application
Type:
Utility
Filling date:
25 May 2021
Issue date:
11 Nov 2021