Intel Corporation
Distributed 3D video for navigation
Last updated:
Abstract:
An embodiment of a semiconductor package apparatus may include technology to request video information from a source outside of a vehicle, receive the video information in response to the request, and construct 3D video information for the vehicle based on the received video information. Other embodiments are disclosed and claimed.
Status:
Grant
Type:
Utility
Filling date:
20 Dec 2017
Issue date:
7 Dec 2021