Intel Corporation
Distributed 3D video for navigation

Last updated:

Abstract:

An embodiment of a semiconductor package apparatus may include technology to request video information from a source outside of a vehicle, receive the video information in response to the request, and construct 3D video information for the vehicle based on the received video information. Other embodiments are disclosed and claimed.

Status:
Grant
Type:

Utility

Filling date:

20 Dec 2017

Issue date:

7 Dec 2021