Intel Corporation
High frequency waveguide structure
Last updated:
Abstract:
An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.
Status:
Grant
Type:
Utility
Filling date:
29 Dec 2016
Issue date:
7 Dec 2021