Intel Corporation
High frequency waveguide structure

Last updated:

Abstract:

An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.

Status:
Grant
Type:

Utility

Filling date:

29 Dec 2016

Issue date:

7 Dec 2021