Intel Corporation
HIGH SPEED MEMORY SYSTEM INTEGRATION

Abstract:

Embodiments disclosed herein include multi-die electronic packages. In an embodiment, an electronic package comprises a package substrate and a first die electrically coupled to the package substrate. In an embodiment, an array of die stacks are electrically coupled to the first die. In an embodiment the array of die stacks are between the first die and the package substrate. In an embodiment, individual ones of the die stacks comprise a plurality of second dies arranged in a vertical stack.