Intel Corporation
Backend electrostatic discharge diode apparatus and method of fabricating the same
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Abstract:
A backend electrostatic discharge (ESD) diode device structure is presented comprising: a first structure comprising a first material, wherein the first material includes metal; a second structure adjacent to the first structure, wherein the second structure comprises a second material, wherein the second material includes a semiconductor or an oxide; and a third structure adjacent to the second structure, wherein the third structure comprises of the first material, wherein the second structure is between the first and third structures. Other embodiments are also disclosed and claimed.
Status:
Grant
Type:
Utility
Filling date:
29 Mar 2018
Issue date:
11 Jan 2022