Intel Corporation
Stiffener build-up layer package

Abstract:

To maintain the integrity of electrical contacts at a build-up layer of a chip package, while reducing electrical interference caused by a chip connected to the build-up layer, the chip package can include a stiffener formed from an electrically conductive material and positioned between the chip and the build-up layer. The chip can electrically connect to the build-up layer through electrical connections that extend through the stiffener. Compared with a stiffener that extends only over a single chip of the chip package, the present stiffener can help prevent warpage or other mechanical deformities that can degrade electrical contacts away from the chip at the build-up layer. Compared with a stiffener that extends only over an area away from the chip, such as a peripheral area, the present stiffener can help reduce electrical interference in an area of the build-up layer near the chip.