Intel Corporation
MODULAR MICROCHANNEL THERMAL SOLUTIONS FOR INTEGRATED CIRCUIT DEVICES

Abstract:

A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.