Intel Corporation
OPTICAL FIBER CONNECTOR ATTACH TO DIE IN WAFER OR PANEL LEVEL TO ENABLE KNOWN GOOD DIE

Abstract:

Embodiments disclosed herein include electronic packages with photonics modules. In an embodiment, a photonics module comprises a carrier substrate and a photonics die over the carrier substrate. In an embodiment, the photonics die has a first surface facing away from the carrier substrate and a second surface facing the carrier substrate, and a plurality of V-grooves are disposed on the first surface proximate to an edge of the photonics die. In an embodiment, the photonics module further comprises a fiber connector attached to the photonics die, where the fiber connector couples a plurality of optical fibers to the photonics die. In an embodiment, individual ones of the plurality of optical fibers are positioned in the V-grooves.