Intel Corporation
Warpage mitigation structures created on substrate using high throughput additive manufacturing

Abstract:

Device package and method of forming a device package are described. The device package has a substrate with dies disposed on the substrate. Each die has a bottom surface that is electrically coupled to the substrate and a top surface. The device package further includes a plurality of stiffeners disposed directly on the substrate. The stiffeners may be directly attached to a top surface of the substrate without an adhesive layer. The device package may include stiffeners with one or more different sizes and shapes, including at least one of a rectangular stiffener, a picture frame stiffener, a L-shaped stiffener, a H-shaped stiffener, and a round pillar stiffener. The device package may have the stiffeners disposed on the top surface of the substrate using a cold spray process. The device package may also include a mold layer formed around and over the dies, the stiffeners, and the substrate.