Intel Corporation
Layered substrate for microelectronic devices
Last updated:
Abstract:
The present disclosure provides systems and methods for a layered substrate. A layered substrate may include a core comprising graphite. The layered substrate may also include a coating layer comprising a coating material that surrounds the core, wherein the coating material has a melting point that is greater than a melting point of silicon.
Status:
Grant
Type:
Utility
Filling date:
1 Apr 2016
Issue date:
25 Jan 2022