Intel Corporation
Layered substrate for microelectronic devices

Last updated:

Abstract:

The present disclosure provides systems and methods for a layered substrate. A layered substrate may include a core comprising graphite. The layered substrate may also include a coating layer comprising a coating material that surrounds the core, wherein the coating material has a melting point that is greater than a melting point of silicon.

Status:
Grant
Type:

Utility

Filling date:

1 Apr 2016

Issue date:

25 Jan 2022