Intel Corporation
Method, System and Apparatus for Protection of Multi-Die Structures

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Abstract:

The disclosure generally provides methods, systems and apparatus to construct a Physically Unclonable Function (PUF) value for an electronic package based on the package's internal components and their interconnects. In one embodiment, the package is a System-On-Chip (SOC) having a plurality of dielets and a plurality of interconnect connecting the dielets. Each of the dielets and each of the interconnects (at one or more locations) may define an entropy source. each entropy source may have an entropy value. Each entropy source communicates an initial entropy value to a PUF aggregator. The PUF aggregator receives and/or aggregates the various entropies from the various entropy sources to construct the native SOC PUF value. The native SOC PUF value defines the authentic PUF value of the SOC at SOC release. Any deviation from the native SOC PUF value may be deemed a security breach of the SOC.

Status:
Application
Type:

Utility

Filling date:

22 Sep 2021

Issue date:

27 Jan 2022