Intel Corporation
STEPPED ELECTRONIC SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGES

Abstract:

An integrated circuit assembly may be formed comprising a stepped electronic substrate having a first surface and an opposing second surface, wherein the first surface comprises a first surface portion or lower step and a second surface portion or upper step. At least one integrated circuit device may be electrically attached to the first surface portion of the first surface of the stepped electronic substrate and an anisotropic conductive layer on the second surface portion of the first surface of stepped electronic substrate. The anisotropic conductive layer may be used to electrically couple the integrated circuit assembly with an additional integrated circuit assembly.