Intel Corporation
MULTIPLE DIES HARDWARE PROCESSORS AND METHODS

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Abstract:

Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.

Status:
Application
Type:

Utility

Filling date:

28 Oct 2021

Issue date:

17 Feb 2022