Intel Corporation
TRANSISTOR STRUCTURES WITH A METAL OXIDE CONTACT BUFFER
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Abstract:
Transistor structures may include a metal oxide contact buffer between a portion of a channel material and source or drain contact metallization. The contact buffer may improve control of transistor channel length by limiting reaction between contact metallization and the channel material. The channel material may be of a first composition and the contact buffer may be of a second composition.
Status:
Application
Type:
Utility
Filling date:
1 Nov 2021
Issue date:
17 Feb 2022