Intel Corporation
Die backend diodes for electrostatic discharge (ESD) protection
Last updated:
Abstract:
Embodiments may relate to a die with a front-end and a backend. The front-end may include a transistor. The backend may include a signal line, a conductive line, and a diode that is communicatively coupled with the signal line and the conductive line. Other embodiments may be described or claimed.
Status:
Grant
Type:
Utility
Filling date:
21 Dec 2019
Issue date:
1 Mar 2022