Intel Corporation
Die backend diodes for electrostatic discharge (ESD) protection

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Abstract:

Embodiments may relate to a die with a front-end and a backend. The front-end may include a transistor. The backend may include a signal line, a conductive line, and a diode that is communicatively coupled with the signal line and the conductive line. Other embodiments may be described or claimed.

Status:
Grant
Type:

Utility

Filling date:

21 Dec 2019

Issue date:

1 Mar 2022