Intel Corporation
Apparatus with embedded fine line space in a cavity, and a method for forming the same
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Abstract:
An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.
Status:
Grant
Type:
Utility
Filling date:
2 Sep 2016
Issue date:
8 Mar 2022