Intel Corporation
Semiconductor package with co-axial ball-grid-array

Abstract:

According to various examples, a device is described. The device may include a printed circuit board. The device may also include a first recess in the printed circuit board, wherein the first recess comprises a circular side surface and a bottom surface. The device may also include a first solder ball disposed in the first recess. The device may also include a first conductive wall positioned behind the circular side surface of the first recess, wherein the first conductive wall surrounds a side surface of the first solder ball.