Intel Corporation
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

Abstract:

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.