Intel Corporation
TANDEM MAGNETICS IN PACKAGE

Abstract:

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a package substrate and a first region in the package substrate. In an embodiment, the first region comprises first conductive routing. The electronic package may further comprise a second region in the package substrate. In an embodiment, the second region comprises second conductive routing. In an embodiment, the second conductive routing is embedded in a magnetic material.