Intel Corporation
TUNABLE STACK-UP DIMM FORM FACTOR COLD PLATE WITH EMBEDDED PELTIER DEVICES FOR ENHANCED COOLING CAPABILITY

Abstract:

An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Peltier devices are to cool first semiconductor chips that face the first outer surface and the second Peltier devices are to cool second semiconductor chips that face the second outer surface.