Intel Corporation
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Abstract:

A device including a package substrate and a heat spreader may be provided. The package substrate may include a first surface and an opposing second surface. The package substrate may include a recess extending from the first surface, and a cavity extending from the second surface to the recess. The heat spreader may include a first portion and a second portion arranged on the first portion. The first portion may be arranged within the cavity, and the second portion may be at least partially arranged on the second surface of the package substrate