Intel Corporation
WRAPPABLE EMI SHIELDS

Abstract:

According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.