Intel Corporation
STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER
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Abstract:
According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit board.
Status:
Application
Type:
Utility
Filling date:
4 Nov 2020
Issue date:
3 Mar 2022