Intel Corporation
Multiple dies hardware processors and methods

Last updated:

Abstract:

Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.

Status:
Grant
Type:

Utility

Filling date:

30 Jun 2020

Issue date:

5 Apr 2022