Intel Corporation
Multiple dies hardware processors and methods
Last updated:
Abstract:
Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
Status:
Grant
Type:
Utility
Filling date:
30 Jun 2020
Issue date:
5 Apr 2022