Intel Corporation
SACRIFICIAL DIELECTRIC FOR LITHOGRAPHIC VIA FORMATION TO ENABLE VIA SCALING IN HIGH DENSITY INTERCONNECT PACKAGING

Abstract:

An apparatus, comprising a substrate comprising a dielectric, a conductor, comprising a via embedded within the dielectric, the via has a first end and a second end, and substantially vertical sidewalls between the first end and the second end, and a conductive structure extending laterally from the first end of the via over the dielectric, wherein the via and the conductive structure have a contiguous microstructure.