Intel Corporation
ENHANCED ELECTRONIC PACKAGE THERMAL DISSIPATION WITH IN-SITU TRANSPIRATION COOLING AND REDUCED THERMAL INTERSTITIAL RESISTANCE

Abstract:

Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.