Intel Corporation
Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit dies

Abstract:

A method includes detecting an open in a first IO element of a first bank of IOs and not in a second bank of IOs. The first and second banks of IOs are in a channel of a first die. The method includes shifting a first connection between the first IO element and a first core fabric of the first die to second connection between a second IO element and the first core fabric. The second IO element is in the first bank of IOs. The method includes shifting a third connection between a third IO element and a second core fabric of a second die to fourth connection between a fourth IO element and the second core fabric. The third and fourth IO elements are in a third bank of IOs of the second die. The method includes not shifting connections in the second and fourth banks of IOs.