Intel Corporation
DIE BACKEND DIODES FOR ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Last updated:
Abstract:
Embodiments may relate to a die with a front-end and a backend. The front-end may include a transistor. The backend may include a signal line, a conductive line, and a diode that is communicatively coupled with the signal line and the conductive line. Other embodiments may be described or claimed.
Status:
Application
Type:
Utility
Filling date:
21 Jan 2022
Issue date:
12 May 2022